| 摘要 |
PROBLEM TO BE SOLVED: To enable testing pads to be arranged in a scribe line region without expanding the scribe line region in area. SOLUTION: A semiconductor wafer 1 is equipped with a plurality of chip regions 3 which are arranged in both lateral and longitudinal directions and scribe line regions 5 which are each provided between the chip regions 3 so as to dice the wafer 1 into unit chip regions 3. The optional chip region 3 is equipped with a circuit pattern which is identical to the circuit pattern obtained by turning around by 180°another circuit pattern formed on the other chip region 3 adjacent to the former in a lateral or a longitudinal direction, and the testing pads 9 used in common for the adjacent chip regions 3 are formed in the scribe line region 5. COPYRIGHT: (C)2005,JPO&NCIPI |
