发明名称 |
Pressure piece for use in a power semiconductor module |
摘要 |
A pressure piece for a compact power semiconductor module for direct mounting on a heat sink. The power semiconductor module has resilient connection leads for electrical connection to a printed circuit board disposed outside the housing. The pressure piece is dimensionally stable and effects pressure-contact between the printed circuit board and the connection leads. On its primary face facing the printed circuit board, the pressure piece has a plurality of pressure elements that space the primary face from the printed circuit board. In a preferred embodiment at least one rib includes a notch. Preferably, the pressure piece has at least one opening connecting its two primary faces permitting fluid flow between the edge of the pressure element and the notch.
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申请公布号 |
US2004242031(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
US20040780981 |
申请日期 |
2004.02.18 |
申请人 |
SEMIKRON ELEKTRONIK GMBH |
发明人 |
GOBL CHRISTIAN;POPP RAINER;LEDERER MARCO |
分类号 |
H01L25/07;H01L23/367;H01L23/40;H01L23/48;H01L25/18;(IPC1-7):H01R12/00 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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