发明名称 APPARATUS FOR TREATING SURFACES OF A SUBSTRATE WITH ATMOSPHERIC PRESSURE PLASMA
摘要 There is provided a surface treatment apparatus with atmospheric pressure plasma. The surface treatment apparatus is comprised of a processing gas storage part and a plasma generating part located below the processing gas storage part in which a) the processing gas storage part comprises a first inlet port through which a processing gas is introduced, and b) the plasma generating part comprising an upper electrode and a lower electrode facing each other, a plasma generating space formed between the electrodes, at least one dielectric insulating the upper electrode and the lower electrode, a radiator lowering the surface temperature of the electrode, a second inlet port through which the processing gas is introduced from the processing gas storage part into the plasma generating space, an outlet port through which a plasma and the processing gas which has not been converted into the plasma are driven to outside of the plasma generating space, and an alternating current supply applying an alternating current voltage, wherein both the upper electrode and the lower electrode are flat-panel electrodes, the outlet port is formed on the lower electrode, and a substrate is located below the lower electrode. The apparatus is not limited to a shape of the substrate, and makes it possible to widen effective processing area of the substrate as well as to perform consecutive processes under atmospheric pressure.
申请公布号 WO2004051702(A3) 申请公布日期 2004.12.02
申请号 WO2003KR02485 申请日期 2003.11.19
申请人 SEM TECHNOLOGY CO., LTD;LEE, HAG-JOO 发明人 LEE, HAG-JOO
分类号 C23C16/50;H01J37/32 主分类号 C23C16/50
代理机构 代理人
主权项
地址