发明名称 Plasma processing device
摘要 Each magnet segment 22 of a magnetic field forming mechanism 21 is constructed such that, after the magnetic pole of each magnet segment 22 set to face a vacuum chamber 1 as shown in FIG. 3A, adjoining magnet segments 22 are synchronously rotated in opposite directions, and hence every other magnet element 22 is rotated in the same direction as shown in FIGS. 3B, 3C to thereby control the status of a multi-pole magnetic field formed in the vacuum chamber 1 and surrounding a semiconductor wafer W. Therefore, the status of a multi-pole magnetic field can be easily controlled and set appropriately according to a type of plasma processing process to provide a good processing easily.
申请公布号 US2004238125(A1) 申请公布日期 2004.12.02
申请号 US20040490027 申请日期 2004.03.19
申请人 ONO HIROO;TATESHITA KOICHI;HONDA MASANOBU;NAGASEKI KAZUYA;HAYASHI DAISUKE 发明人 ONO HIROO;TATESHITA KOICHI;HONDA MASANOBU;NAGASEKI KAZUYA;HAYASHI DAISUKE
分类号 H05H1/46;C23F1/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;H01L21/31;(IPC1-7):C23F1/00 主分类号 H05H1/46
代理机构 代理人
主权项
地址