| 摘要 |
PROBLEM TO BE SOLVED: To provide an addition curing type silicone composition which is useful for sealing semiconductor devices, does not have problems on the defoaming of the composition and on the remaining of low mol.wt. components, gives a cured product having improved cold resistance, and can thereby improve the reliability of the semiconductor devices, and to provide the semiconductor device using the silicone composition. SOLUTION: This addition curing type silicone composition for sealing semiconductor devices comprises (A) a diorganopolysiloxane containing at least two alkenyl groups bound to silicon atoms, (B) an organopolysiloxane having a resin structure which comprises SiO4/2 units, Vi(R2)2SiO1/2 units, and R23SiO1/2 units (Vi is vinyl group; and R2 is a non-substituted or substituted monovalent hydrocarbon not containing an aliphatic unsaturated bond), (C) an organohydrogen polysiloxane containing at least two hydrogen atoms bound to silicon atoms, and (D) a platinum group metal-based catalyst. A semiconductor device 1 sealed with the cured product 2 of the silicone composition. |
