| 发明名称 |
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a fine pitch of a wiring part and reduce the accuracy of a mounting position of a semiconductor chip. <P>SOLUTION: The width W2 of a bottom of a projecting electrode 4' arranged in a zigzag manner on a second row is made smaller than that W1 of the bottom of a projecting electrode 4 on a first row, and the length L2 of the bottom of the projecting electrode 4' on the second row is made larger than that L1 of the bottom of the projecting electrode 4 on the first row. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
| 申请公布号 |
JP2004342993(A) |
申请公布日期 |
2004.12.02 |
| 申请号 |
JP20030140591 |
申请日期 |
2003.05.19 |
| 申请人 |
SEIKO EPSON CORP |
发明人 |
YUZAWA HIDEKI |
| 分类号 |
H01L21/60;H01L21/56;H01L23/485;H01L23/498 |
主分类号 |
H01L21/60 |
| 代理机构 |
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