发明名称 CONNECTION STRUCTURE OF ELECTRONIC CIRCUIT, AND METHOD OF CONNECTING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a connection structure of electronic circuit and a method of connecting electronic circuit wherein a connection member such as solder is never short-circuited due to flowing even if microfabricating a connection land. <P>SOLUTION: The connection structure consists of a circuit board 10 having a first connection land 12 consisting of a plurality of conductor patterns formed on its surface, and a flexible substrate 20. The flexible substrate 20 is arranged so as to face the circuit board 10 and comprises a second connection land 24 which faces the first connection land 12 of the circuit board 10 and an insulation layer 26 formed so as to surround at least a part of the outer periphery of the second connection land 24. The first connection land 12 and the second connection land 24 are connected by the connection member 30, and the insulation layer 26 is formed to be thicker than the total thickness of the second connection land 24 and the first connection land 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004342969(A) 申请公布日期 2004.12.02
申请号 JP20030140162 申请日期 2003.05.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HIGASHIDA TAKAAKI;YAMAMOTO KENICHI;SUETSUGU DAISUKE;NAGAOKA YOSHIYUKI;IMANAKA TAKASHI;NITTA TOSHIYA
分类号 H05K1/14;H01L21/60;H05K3/32;H05K3/34;H05K3/36;(IPC1-7):H05K1/14 主分类号 H05K1/14
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