| 摘要 |
PROBLEM TO BE SOLVED: To provide an SAW device for which void generation and resin intrusion to an airtight space are prevented at the time of laminating resin in the SAW device in which the airtight space is formed below an IDT by coating the outer surface of an SAW chip mounted on a mounting substrate base material with a heated and softened resin sheet and filling the resin in a skirt part of the SAW chip, and provide its manufacturing method. SOLUTION: A frame body overlapping with the peripheral edge part of the surface acoustic wave chip is formed on the upper surface of the mounting substrate, the frame body is thinner than a gap between the surface acoustic wave chip and the mounting substrate, and the frame body is formed so as to cover the dicing cut margin of the mounting substrate base material along the dicing cut margin. COPYRIGHT: (C)2005,JPO&NCIPI
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