| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor device where volatile components of ultraviolet-curable resin serving as adhesives is prevented from remaining and curing to be foreign matter when photodetecting light of≤450 nm by excluding the volatile component to the outside of a package. SOLUTION: The optical semiconductor device consists of an optical semiconductor substrate 4, and the package 1 and a sealing cap 2 both of which are for sealing this. The package 1 has an open top, which is sealed with the sealing cap 2. The package 1 and the sealing cap 2 are stuck to each other through the ultraviolet-curable resin. A hole 3 for releasing atmosphere inside of the package to the outside is bored at the package 1. At the optical semiconductor substrate 4, a photodetection element 5 and a circuit element 6 for amplifying/converting a current signal generated by the photodetection element are formed. In the optical semiconductor device provided with the sealing cap by boring an air hole for releasing gas inside of the package to the outside, it is possible to suppress the evaporated gas of the ultraviolet-curable resin from curing on the inner surface of the package of the sealing cap by a blue laser beam. COPYRIGHT: (C)2005,JPO&NCIPI
|
