| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering apparatus in which film deposition distribution and coverage distribution are more improved compared with a conventional sputtering apparatus. SOLUTION: In the sputtering apparatus at least composed of a substrate, a substrate holder holding the substrate, a target for depositing a thin film on the substrate, a sputtering cathode mounted with the target and a magnet arranged at the rear face of the target, the axis of the target is made inclined to the axis of the sputtering cathode, further, the sputtering cathode is rotated, and the target is moved in a shaking manner with respect to the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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