| 摘要 |
PURPOSE: A method of forming a semiconductor test pattern is provided to perform smoothly a corresponding test without the degradation of a small resistive pattern and to secure the reliability of the test by forming thickly a connection line between the small resistive pattern and a large resistive pattern. CONSTITUTION: A plurality of pads(34,36,38,40,42,44) are arrayed to test a small resistive pattern(30) and a large resistive pattern(32). A connection line(46) is formed between at least one out of the pads and a withdrawal position of the large resistive pattern. The width of the connection line is larger than that of the large resistive pattern.
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