发明名称 LITHOGRAPHY APPARATUS, MANUFACTURING METHOD OF DEVICE, AND DEVICE MANUFACTURED BY IT
摘要 PROBLEM TO BE SOLVED: To provide a lithography apparatus wherein although during processings in a lithography projection apparatus a wafer is clamped onto a wafer holder with retaining force such as vacuum, and although when the wafer is released from the wafer holder after the completion of the processings, releasing force is applied to the wafer by an exhaust pin, the wafer and/or the wafer holder might be damaged in the last step of the release of energy stored in the wafer due to distortion by the releasing force, so that such harmful energy is prevented from being left behind. SOLUTION: The wafer retained on the wafer holder is released by applying the releasing force by a discharge pin. Since the releasing force is weakened by a control device just before final release, the quantity of energy absorbed by the wafer is decreased, and hence the energy during the release is prevented from damaging the wafer and/or the wafer holder. Further, surplus energy may be absorbed by providing a protective rim on an outer periphery of protrusions forming the retaining surface of the wafer holder. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004343110(A) 申请公布日期 2004.12.02
申请号 JP20040138363 申请日期 2004.05.07
申请人 ASML NETHERLANDS BV 发明人 ZAAL KOEN JACOBUS JOHANNES MARIA;VAN EMPEL TJARKO ADRIAAN RUDOLF;VAN MEER ASCHWIN LODEWIJK HENDRICUS JOHANNES;MIEDEMA JAN REIN;OTTENS JOOST JEROEN
分类号 H01L21/683;G03F7/20;H01L21/027;(IPC1-7):H01L21/027;H01L21/68 主分类号 H01L21/683
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