发明名称 CONDUCTIVE CONNECTION FILM AND CONDUCTIVE CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a conductive connection film and a conductive connection structure which can exhibit high connection stability even if height of electrodes on a substrate differs, and restoration of a breakage portion is easy. SOLUTION: The conductive connection film, in which conductive particulate 2 are embeded in a resin film 4 provided with a soft resin layer 1 and a surface layer formed on the resin layer 1, is characterized in that at least a part of the conductive particulate 2 is exposed from the resin film, and at least one surface layer of the resin film is a rigid resin layer 3. The conductive connection structure is characterised in that the conductive connection film is installed between mutually facing electrodes to be conductively connected. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004342764(A) 申请公布日期 2004.12.02
申请号 JP20030136300 申请日期 2003.05.14
申请人 SEKISUI CHEM CO LTD 发明人 SUZUKI TAKUO;WATABE KOJI
分类号 H01R11/01;H01B5/16;H05K1/14;(IPC1-7):H05K1/14 主分类号 H01R11/01
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