| 摘要 |
The invention relates to the fabrication of image sensors, and especially to color image sensors. The image sensor comprises a region MP, in which there is a photosensitive matrix onto which the image to be converted into electronic signals is projected, and an outer region ZE comprising peripheral electronic circuits for driving the matrix or for processing the image signals. After formation, on a substrate 30, of a stack of conducting layers and insulating layers serving for the production of the matrix and of the peripheral circuits, a substantial thickness of insulation is removed, only in the region MP of the matrix, before a mosaic of color filters is deposited, so as to reduce the height H1 of the filters relative to the photosensitive regions. This results in an improvement in the contrast and the colorimetry.
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