发明名称 |
HARZZUSAMMENSETZUNG,FORMGEGENSTAND UND VERWENDUNG |
摘要 |
<p>A resin composition which comprises 100 parts by weight of a synthetic resin and 50 to 1,500 parts by weight of magnesium oxide particles, wherein the magnesium oxide particles satisfy the following requirements (i) to (v): (i) an average secondary particle diameter of 0.1 to 130 mu m, (ii) a BET method specific surface area of 0.1 to 5 m<2>/g, (iii) a total content of an Fe compound and an Mn compound of 0.01 wt% or less in terms of metals, (iv) an Na content of 0.001 wt% or less, and (v) a Cl content of 0.005 wt% or less, and a molded product formed therefrom. Since the resin composition of the present invention has excellent flame retardancy, heat conductivity and water resistance, it is advantageously used as a material for sealing a heat generating electronic member such as a semiconductor.</p> |
申请公布号 |
DE60015300(D1) |
申请公布日期 |
2004.12.02 |
申请号 |
DE2000615300 |
申请日期 |
2000.11.21 |
申请人 |
KYOWA CHEMICAL INDUSTRY CO. LTD., TAKAMATSU |
发明人 |
ANABUKI, HITOSHI;YOKOZEKI, MACHIKO |
分类号 |
C08J5/18;C08K3/22;C08L63/00;C08L83/04;C08L101/00;H01L23/29;H01L23/31;(IPC1-7):C08L101/00;C08K9/00;C08J5/00 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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