METHOD OF FORMING PHOTOMASK PATTERN AND METHOD OF INSPECTING PROCESS FAILURES IN PRE-ACTIVE FORMATION STEP OF SEMICONDUCTOR PROCESS

摘要

PURPOSE: A method of forming a photomask pattern and a method of inspecting process failures in a pre-active formation step of a semiconductor process are provided to check easily failures by performing an ion-implantation process or an align-key forming process using a first photoresist pattern and a second photoresist pattern. CONSTITUTION: A photoresist layer is coated on a bare wafer(S10). A first photoresist pattern for defining a shot boundary region and a second photoresist pattern are formed by exposing selectively the photoresist layer(S12). The second photoresist pattern is provided as a mask pattern in a pre-active formation process. The pre-active formation process includes an ion-implantation process or an align-key forming process.