发明名称 PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD USING THE SAME, METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD AND PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive element which suppresses filiform undeveloped parts (deficiency of resolution) which occurs in a part where the interval between resist patterns is narrow while maintaining superior resolution, and can form a resist pattern whose side face shape is good. <P>SOLUTION: The photosensitive element has on a resin film a photosensitive layer comprising a photosensitive resin composition containing (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein the component (A) includes a low molecular weight binder polymer whose weight average molecular weight is 10,000 to 30,000 and the resin film has a haze of &le;1%. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004341478(A) 申请公布日期 2004.12.02
申请号 JP20030372998 申请日期 2003.10.31
申请人 HITACHI CHEM CO LTD 发明人 KUBOTA MASAO;OHASHI TAKESHI;TAKANO SHINJI;ISO JUNICHI
分类号 G03F7/004;G03F7/027;G03F7/033;G03F7/09;H05K3/06;H05K3/18 主分类号 G03F7/004
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