MANUFACTURING METHOD OF OPTICAL CIRCUIT-ELECTRIC CIRCUIT CONSOLIDATION SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing method of an optical circuit-electric circuit consolidation substrate with which a high-quality optical circuit-electric circuit consolidation substrate can be obtained with a simple method using the conventional printed wiring board manufacturing method.

SOLUTION: In this manufacturing method, laminated material 3 which is equipped at least with a photosensitive resin layer 1 which consists of photosensitive transparent resin whose solubility or refractive index is changed through irradiation with an active energy beam and a metal layer 2 is used. Then, the laminated material 3 is processed with processes which include (a) a process for forming core parts 4a of an optical waveguide 4 by irradiating the photosensitive transparent resin layer 1 with the active energy beam, (b) a process for forming a deflection part 5 which deflects light propagating the optical waveguide 4 and emits it to the outside or which deflects light from the outside of the optical waveguide 4 and makes it enter into the optical waveguide 4 and (c) a process for forming an electric circuit 6 by working the metal layer 2.

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