| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To inspect the position, number, size and the like of the microflaw in a solid material of every kind inclusive of a semiconductor device or a metal material at a high speed with special resolving power with a nanometer order. <P>SOLUTION: A converged electron beam device is loaded with a positive electron irradiating function, and flaw position data, converged electron beam position data and the number of flaws or the size of a flaw are obtained from the detection data ofγrays generated by the pair extinction of electrons and positive electrons, and these two-dimensional distribution data are displayed on a monitor. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
