发明名称 COMPLIANT SUBSTRATE FOR HETEROEPITAXY, HETEROEPITAXIAL STRUCTURE, AND COMPLIANT-SUBSTRATE FABRICATING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a compliant substrate for heteroepitaxies, a heteroepitaxial structure, and a compliant substrate fabricating method. <P>SOLUTION: The compliant substrate 1 includes a carrier substrate 2, a buried layer 3, and a single crystal top layer. The buried layer 3 is present between the carrier substrate 2 and the single crystal top layer 4, and the region of the top layer and /or the interface between the buried layer and the top layer or a region 5 of the vicinity thereof are weakened. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004343046(A) 申请公布日期 2004.12.02
申请号 JP20040006055 申请日期 2004.01.13
申请人 SOI TEC SILICON ON INSULATOR TECHNOLOGIES 发明人 AKATSU TAKESHI
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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