发明名称 RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide an adhesive resin composition excellent in adhesive strength, wherein the decrease in the adhesive strength is improved, and a flexible printed wiring board made of the same. SOLUTION: The resin composition essentially comprises (1) an epoxy resin containing at least two epoxy groups within a molecule, (2) a carboxy group-containing elastomer and (3) a metal salt containing a polyvalent metal ion. Here, the amount of the metal salt containing the polyvalent metal ion calculated in terms of a metal cation is 0.01-1 pt.wt. against 100 pts.wt. carboxy group-containing elastomer. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004339279(A) 申请公布日期 2004.12.02
申请号 JP20030134786 申请日期 2003.05.13
申请人 MITSUI CHEMICALS INC 发明人 YAMAZAKI SUSUMU;TANABE TOSHIO;TAWARA SHUJI
分类号 C08L63/00;C08K3/10;C08L101/08;H05K1/03;(IPC1-7):C08L63/00 主分类号 C08L63/00
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