发明名称 |
LOW-COST CIRCUIT BOARD MATERIALS AND PROCESSES FOR AREA ARRAY ELECTRICAL INTERCONNECTIONS OVER A LARGE AREA BETWEEN A DEVICE AND THE CIRCUIT BOARD |
摘要 |
<p>An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.</p> |
申请公布号 |
WO2004105131(A1) |
申请公布日期 |
2004.12.02 |
申请号 |
WO2003US23755 |
申请日期 |
2003.07.30 |
申请人 |
SARNOFF CORPORATION |
发明人 |
PALANISAMY, PONNUSAMY |
分类号 |
G02F1/133;G02F1/1333;G02F1/1339;H01J17/28;H01J29/00;H01L27/32;H01L51/52;H05K1/02;H05K1/14;H05K1/18;H05K3/32;H05K3/34;H05K3/36;H05K7/20;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;H01L21/50;H01L21/48;H01L21/44 |
主分类号 |
G02F1/133 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|