发明名称 LOW-COST CIRCUIT BOARD MATERIALS AND PROCESSES FOR AREA ARRAY ELECTRICAL INTERCONNECTIONS OVER A LARGE AREA BETWEEN A DEVICE AND THE CIRCUIT BOARD
摘要 <p>An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.</p>
申请公布号 WO2004105131(A1) 申请公布日期 2004.12.02
申请号 WO2003US23755 申请日期 2003.07.30
申请人 SARNOFF CORPORATION 发明人 PALANISAMY, PONNUSAMY
分类号 G02F1/133;G02F1/1333;G02F1/1339;H01J17/28;H01J29/00;H01L27/32;H01L51/52;H05K1/02;H05K1/14;H05K1/18;H05K3/32;H05K3/34;H05K3/36;H05K7/20;(IPC1-7):H01L23/48;H01L23/52;H01L29/40;H01L21/50;H01L21/48;H01L21/44 主分类号 G02F1/133
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