| 摘要 |
The invention relates to a method for connecting a hollow profile (1) to a t wo- dimensionally contacting vehicle component (2) by means of soldering. According to the inventive method, a solder (4) is inserted between the holl ow profile (1) and the component (2) and is then liquefied by supplying energy so as to form a solid connection between the hollow profile (1) and the compone nt (2) when solidifying. In order to create a simple way of forming a durable soldered joint between the hollow profile (1) and a component (2) that has a ny design and two-dimensionally rests thereagainst, a cavity (3) is embodied on said component (2), the solder (4) is deposited in said cavity (3), the component (2) is then placed relative to the hollow profile (1) such that th e opening (6) of the cavity faces the hollow profile (1), whereupon the cavity zone of the component (2) is impinged upon by electrical resistance in the contacting position, a pressing force being applied to the exterior face (8) of the cavity by means of a resistance welding electrode.
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