| 摘要 |
PURPOSE: An integrated image sensor module is provided to reduce remarkably the size, to simplify manufacturing processes and to reduce fabrication cost by forming an arc-shaped protrusion for focusing an optical signal on a transparent layer. CONSTITUTION: An integrated image sensor module includes a substrate, a frame layer, a photosensitive chip, a plurality of electric elements, a plurality of wires, and a transparent layer. The substrate(40) includes an upper end(50) and a lower end(52). The frame layer(42) with a first surface(58) and a second surface(60) is installed on the substrate to form a cavity(62) together with the substrate. The photosensitive chip(44) with a plurality of bonding pads(64) is mounted on the substrate within the cavity. The electric elements(47) are mounted on the substrate in the cavity. The wires(46) are used for connecting electrically the bonding pads of the chip with the substrate. The transparent layer(48) includes an arc-shaped protrusion(66) corresponding to the chip.
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