| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component module wherein the electronic components with different frequency bands are incorporated in one package and whereon the electronic components subjected to heat compression bonding are mounted while suppressing the propagation loss. <P>SOLUTION: The electronic component module is provided with a mount board 11 provided with a shield layer 13 wherein first and second cavities 14a, 14b are demarcated, a first electronic component 16a placed in the first cavity 14a and used for a first frequency band, a second electronic component 16b placed in the second cavity 14b and used for a second frequency band, a lid member 15 for applying shield sealing to the first and second cavities 14a, 14b, and a patch antenna 17 for transceiving a radio wave with each frequency band and connected to the electronic components 16. The electronic components 16 are mounted on the mount board 11 via a board component 19 with a higher heat resistance than that of the mount board 11, and the mount board 11 is configured with a member having a dielectric constant lower than that of the board component 19. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
