| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor connecting apparatus which accurately decides an interval between a semiconductor chip and a mounting substrate and connects the semiconductor chip to the mounting substrate. <P>SOLUTION: The semiconductor connecting apparatus interposes an elastic member 22 between the semiconductor chip 10 and the mounting substrate 18 and mounts the semiconductor chip 10. The semiconductor connecting apparatus includes a holding unit 9 for holding the semiconductor chip 10 oppositely to the mounting substrate 18, a close coupled gas bearing 7 which can move in the connecting direction of the semiconductor chip 10 to the mounting substrate 18, the close coupled gas bearing 7 movable in the connecting direction of the semiconductor chip 9 to the mounting substrate 18, a voice coil motor 11 coupled to the close coupled gas bearing 7, a load cell 15 for detecting a pressing force applied by the holding unit 9 to the elastic member 22, and a drive unit 13 for generating a drive signal in response to the pressing force detected by the load cell 15 to drive the voice coil motor 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
