| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein the temperature rises by the heat generated in the semiconductor components, or the like, of a printed circuit board in high-speed recording, the performance and lifetime of the components deteriorate when recording/reproducing information, and hence malfunction occurs since a disk device becomes multifunctional and a change from a reproduction-only machine to a recording/reproducing machine proceeds. SOLUTION: A heat transport member is provided from the semiconductor component to a region that is surrounded only by a chassis and a cover, where a disk is inserted . The heat transport member is provided from the semiconductor component, or the like, to the region that is surrounded by a lower chassis and an upper cover, where a disk is inserted, thus efficiently radiating heat generated from the semiconductor component, or the like, of the printed circuit board to the outside of the device. As a result, the temperature rise inside the disk device can be reduced, deterioration in the performance and lifetime and the malfunction caused by the heat can be prevented, and hence the reliable, high-quality disk device can be provided. COPYRIGHT: (C)2005,JPO&NCIPI
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