发明名称 VACUUM FILM DEPOSITION SYSTEM FOR FILM, AND PLASTIC FILM USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a sputtering system by which a satisfactory thin film reduced in defects can continuously be deposited with high efficiency, and to provide a plastic film having a satisfactory thin film reduced in defects using the same. SOLUTION: The vacuum film deposition system for a film is at least provided with an unwinding apparatus, a degassing apparatus, two or more sputtering systems in which a temperature control drum is located on the back side of a film, and a winding apparatus. The first sputtering system closest to the unwinding apparatus is driven by electric power of 0.15 to 6 W/cm<SP>2</SP>, and the sputtering system on and after the second one is driven by electric power higher than that in the first sputtering system. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004339602(A) 申请公布日期 2004.12.02
申请号 JP20030197395 申请日期 2003.07.15
申请人 SUMITOMO BAKELITE CO LTD 发明人 EGUCHI TOSHIMASA;MARUYAMA HIRONORI
分类号 C23C14/34;C23C14/56;(IPC1-7):C23C14/34 主分类号 C23C14/34
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