发明名称 Method of fabricating a semiconductor device
摘要 In a manufacturing process of a semiconductor device using a substrate having low heat resistance, such as a glass substrate, there is provided a method of efficiently carrying out crystallization of a semiconductor film and gettering treatment of a catalytic element used for the crystallization by a heating treatment in a short time without deforming the substrate. A heating treatment method of the present invention is characterized in that a light source is controlled in a pulsed manner to irradiate a semiconductor film, so that a heating treatment of the semiconductor film is efficiently carried out in a short time, and damage of the substrate due to heat is prevented.
申请公布号 US2004241967(A1) 申请公布日期 2004.12.02
申请号 US20040882634 申请日期 2004.07.02
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;TAKANO TAMAE;DAIRIKI KOJI
分类号 H01L29/786;H01L21/20;(IPC1-7):C30B1/00;H01L21/76;H01L21/36 主分类号 H01L29/786
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