| 摘要 |
<P>PROBLEM TO BE SOLVED: To clean sucking nozzles sucking an electronic component with a simple constitution in an electronic component holding device. <P>SOLUTION: Vertical movement means (sub-mount head driving means 52 and chip head driving means 53) and a head moving means 7 move sucking heads (sub-mount head 32 and chip head 33) by using an operation when a die bonding device 1 (electronic component holding device ) bonds a die. Tips (42a and 43a) of sucking nozzles (sub-mount nozzle 42 and chip nozzle 43) installed in the sucking heads are abutted on a cleaning stand 6. Rotation driving means (82 and 83) rotate the sucking nozzles. Thus, foreign matters adhered to the tips of the sucking nozzles are removed by rubbing them to a cleaning means. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
