发明名称 SOLDERING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a soldering equipment capable of soldering a plastic wiring film using an inexpensive polyester film at a high temperature. SOLUTION: The equipment is constituted so that wiring 11 and 12 of a polyester wiring film 10 whose heat resistant temperature is low and wiring 21 and 22 of a polyimide wiring film 20 whose heat resistant temperature is high are polymerized with soldering agent 41 and 42 interposed, and infrared lights 31 outputted by an infrared light source 30 are emitted from the polyimde wiring film 20 side, and the wires 11, 21, 12 and 22 are soldered at a high temperature. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004342982(A) 申请公布日期 2004.12.02
申请号 JP20030140339 申请日期 2003.05.19
申请人 ORIGIN ELECTRIC CO LTD;NTT POWER & BUILDING FACILITIES INC;TOWA PRINT KOGYO KK;EERU DENSHI KK 发明人 UEDA TAKEHARU;MOTOJIMA YASUHIRO;MATSUSHIMA TOSHIO;KIYOKAWA ICHIRO;TSUJIKAWA TOMONOBU;YABUTA KAHO;MIMURA YUSUKE;IMAHORI AKIRA;KIGAMA SHOGO
分类号 B23K1/005;B23K101/42;H05K1/02;H05K3/34;H05K3/36;(IPC1-7):H05K3/36 主分类号 B23K1/005
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