发明名称 Conductor layer nitridation
摘要 Methods and apparatus for forming word line stacks comprise forming a thin nitride layer coupled between a bottom silicon layer and a conductor layer. In a further embodiment, a diffusion barrier layer is coupled between the thin nitride layer and the bottom silicon layer. The thin nitride layer is formed by annealing a silicon oxide film in a nitrogen-containing ambient.
申请公布号 US2004238845(A1) 申请公布日期 2004.12.02
申请号 US20040881630 申请日期 2004.06.30
申请人 MICRON TECHNOLOGY. INC. 发明人 HU YONGJUN;THAKUR RANDHIR P.S.;DEBOER SCOTT
分类号 H01L21/28;H01L21/8242;H01L29/49;(IPC1-7):H01L29/40 主分类号 H01L21/28
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