发明名称 Cleaning agent including a corrosion inhibitor used in a process of forming a semiconductor device
摘要 A cleaning solution having a corrosion inhibitor and a surfactant is disclosed. The corrosion inhibitor is represented by formula 1 and the surfactant is represented by the formula 2 as follows: R1-R2-C=C-R3-R4 <Formula 1> R5-(CH2)K-A <Formula 2> In formula 1, any one of R1 and R4 is a hydroxyl group (-OH) and the other is hydrogen (-H), a halogen element (-X) or one functional group selected from the group consisting of alkyl (-R) group, alkoxy (RO-) group, amino (-NH2) group, nitro (-NO2) group, mercapto (-SH) group, hydroxyl (-OH) group, aldehyde (-CHO) group and carboxyl (-COOH) group. R2 and R3 are hydrocarbons having 0 to 10 carbons including a straight or a branched structure. In formula 2, R5 is methyl group and K is an integer ranging from 3 to 22. A is HO(CH2CH2O)L(CH(CH3)CH2O)M or hydroxyl group, and L and M are integers ranging from 0 to 15.
申请公布号 US2004242446(A1) 申请公布日期 2004.12.02
申请号 US20040774783 申请日期 2004.02.09
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 MUN CHANG-SUP;CHOI SANG-JUN;HAN WOO-SUNG;HONG CHANG-KI
分类号 C11D3/00;C11D3/02;C11D3/16;C11D3/20;C11D11/00;C23G1/06;C23G1/18;H01L21/304;(IPC1-7):C11D1/00 主分类号 C11D3/00
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