| 摘要 |
The aim of this invention is to obtain a very cheap electronic module while maintaining a high level of reliability regardless of the field of application. In particular, this concerns the protection of an electronic circuit that is integrated into the module by means of insulating layers. The electronic module according to the invention comprises an assembly including a substrate, a conductive layer including a plurality of tracks and at least one electronic component. This assembly constituting an electronic circuit (1) is provided with a first area free of component (A) and a second area (B) where the electronic component (3) is located. This circuit (1) is covered on at least one of its faces with an insulating layer (2) with a generally uniform thickness. The electronic module is characterized in that this insulating layer (2) fits the first area (A) and includes in the second area (B) at least one bump (4) obtained by pressing the insulating layer (2) with a plate (20) including a depression (4'). The object of this invention also concerns a manufacturing method of an electronic module characterized in that the assembly of the insulating layer (2) on the circuit face including the electronic component (3) is achieved by lamination by means of a plate (20) including at least one depression (4') in front of the area (B) where the electronic component (3) is located on the circuit (1).
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