| 摘要 |
An electronic assembly is provided, with a socket body having a support plane. The support plane supports a surface of a package substrate, especially a contoured package substrate, and thereby limits the extent of travel of springs held by the socket body. Spring fingers are also provided to align the package substrate in x- and y-directions relative to the socket springs. A relief opening is formed to remove a circular chamfer that can inhibit movement of a package substrate up to side surfaces of the socket body.
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