发明名称 Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate
摘要 A method for forming an embedded three-dimensional inductor is provided. Generally, a first coil winding is formed. A first dielectric layer is placed on the first coil winding. At least part of second coil winding is formed on the first dielectric layer and part of the first coil winding to create an electrical contact between the first coil winding and the second coil winding. A first tape layer with a cavity is provided, where the first coil winding, the first dielectric layer, and the second coil winding are within the cavity of the first tape layer.
申请公布号 US2004239469(A1) 申请公布日期 2004.12.02
申请号 US20040884597 申请日期 2004.07.02
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 BRANCHEVSKY SHAUL
分类号 H01L23/498;H05K1/03;H05K1/16;H05K1/18;H05K3/40;(IPC1-7):H01F5/00 主分类号 H01L23/498
代理机构 代理人
主权项
地址