Vorrichtung und Verfahren zur Montage eines elektronischen Bauteils

摘要

A solvent, flux or paste transfer unit (100) is made a slide type and a plurality of nozzles (8) at a head part which suck and hold components (33) are moved down simultaneously to transfer the flux to the electronic components. In comparison with an electronic component mounting method including a transfer operation whereby the nozzles are lowered one by one by a conventional electronic component mounting apparatus equipped with a rotary type solvent, flux or paste transfer unit, a time for moving the nozzles up, down is shortened and a total cycle time is reduced, so that production efficiency is improved.