| 摘要 |
PURPOSE: A trimming and marking apparatus for a semiconductor fabrication process is provided to improve working efficiency and to prevent degradation of product in quality by performing simultaneously trimming and marking using laser beam. CONSTITUTION: A trimming and marking apparatus includes a control unit, a laser unit, an optical unit, and a working die unit. The laser unit(26) includes a first laser part(26b) for forming a first laser beam for marking a character and a second laser part(26b) for forming a second laser beam for trimming. The first laser part generates a low power laser beam and the second laser part generates a high power laser beam.
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