发明名称 Image sensor module for image taking chips, containing substrate with top and bottom side interconnected electrodes, with photosensitive chip mounted on top side of substrate and coupled to top side electrodes
摘要 <p>Top side (58) of substrate (50) carries first electrodes (62) and its bottom side (60) interconnected second electrodes (64). On top side is fitted photosensitive chip (52). Lens holder (54), glued to substrate top side, has through aperture (71) from top (68) to bottom (70).Top end of aperture is threaded inside, while its bottom end is enlarged by recess (74). Gluing of lens holder to substrate top side ensures that chip lies within aperture of lens holder. Lens tube (56) has outer thread for screwing into inner thread of lens holder.</p>
申请公布号 DE202004015010(U1) 申请公布日期 2004.12.02
申请号 DE20042015010U 申请日期 2004.09.27
申请人 KINGPAK TECHNOLOGY INC., CHUPEI 发明人
分类号 H01L27/146;H01L31/0203;H01L31/0232;H04N5/335;(IPC1-7):H01L27/146;H01L31/020;H01L31/023 主分类号 H01L27/146
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