发明名称 |
Image sensor module for image taking chips, containing substrate with top and bottom side interconnected electrodes, with photosensitive chip mounted on top side of substrate and coupled to top side electrodes |
摘要 |
<p>Top side (58) of substrate (50) carries first electrodes (62) and its bottom side (60) interconnected second electrodes (64). On top side is fitted photosensitive chip (52). Lens holder (54), glued to substrate top side, has through aperture (71) from top (68) to bottom (70).Top end of aperture is threaded inside, while its bottom end is enlarged by recess (74). Gluing of lens holder to substrate top side ensures that chip lies within aperture of lens holder. Lens tube (56) has outer thread for screwing into inner thread of lens holder.</p> |
申请公布号 |
DE202004015010(U1) |
申请公布日期 |
2004.12.02 |
申请号 |
DE20042015010U |
申请日期 |
2004.09.27 |
申请人 |
KINGPAK TECHNOLOGY INC., CHUPEI |
发明人 |
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分类号 |
H01L27/146;H01L31/0203;H01L31/0232;H04N5/335;(IPC1-7):H01L27/146;H01L31/020;H01L31/023 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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