| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve measuring sensitivity by providing an air gap opened at a semiconductor substrate side oppositely to a heater on an insulating layer on a surface of the substrate and temperature sensors disposed at upstream side, downstream side of the heater. SOLUTION: A thin film insulating layer 3 is formed on a surface of a semiconductor substrate 2, and a heater 11, an upstream side temperature measuring resistor 12 and a downstream side temperature measuring resistor 13 are formed on the layer 3. Lower portions of the heater 11, the resistors 12, 13 are removed by etching from their surface sides to form air gaps 4a, 4b, 4c. Thus, crosslinked bridges 5a, 5b, 5c are formed at the lower portions of the heater 11 and the resistors 12, 13 on the substrate 1. Thus, the substrate 11 is retained between the heater 11 and the resistor 12 and between the heater 11 and the resistor 13 to suppress transfers of the heat of the heater to the resistors 12, 13.</p> |
