发明名称 POLISHING TOOL PRESSURE DISTRIBUTION MEASURING METHOD AND POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing tool pressure distribution measuring method which enables a measurement of a pressure distribution generated between a polishing tool surface and a workpiece in real time by using a photoelastic phenomenon as a means for measuring the pressure distribution with high accuracy, in order to visualize and clarify a polishing process and carry out the polishing with high accuracy and high stability, and to provide a polishing tool and a polishing device. <P>SOLUTION: In implementation of the polishing tool pressure distribution measuring method, a system is employed which comprises a photoelasticity generating optical system for measuring the pressure distribution, based on the polishing device, a heterodyne polarimeter for measuring the photoelasticity with high accuracy, a photoelastic phase modulator for enabling automatic measurement, a control system for controlling a measuring system location, an image signal processing computer for processing fetched signal data, etc. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004337993(A) 申请公布日期 2004.12.02
申请号 JP20030134041 申请日期 2003.05.13
申请人 CANON INC 发明人 HANEYA SATOSHI
分类号 G01L5/00;B24B37/005;B24B49/12;H01L21/304 主分类号 G01L5/00
代理机构 代理人
主权项
地址