| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic board which is light in weight, is superior in a temperature rise/fall characteristics, there is no warpage at high temperatures, moreover, can mount a large silicon wafer, and is most suitable as equipment for manufacturing semiconductors, such as a hot plate, an electrostatic fastener, and a wafer prober. <P>SOLUTION: The ceramic board, for use in the equipment of manufacturing semiconductor, is equipped with a reinforcement body composed of a metal or a conductive ceramic; the inside or on the surface of the ceramic-base board which is 200 mm or larger in diameter, is less than 8 mm in thickness; and its Young's modulus is 250 to 450 GPa, at in 25 to 800°C. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
