PROCESS FOR FABRICATING MULTILAYER ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a process for fabricating a multilayer ceramic capacitor 10 in which productivity is enhanced by a step for filling the through hole 26 of a multilayer sheet 100 with conductive paste. SOLUTION: The process for fabricating the multilayer ceramic capacitor 10 comprises steps for: laying a ceramic layer 22 and an inner electrode layer 24 alternately and forming a through hole 26 through the ceramic layer and the inner electrode layer 24 by means of a laser thus forming the multilayer sheet 100; forming a multilayer aggregate 100M by laying a plurality of multilayer sheets 100 while aligning each through hole 26 of the multilayer sheet 100; and forming a via electrode 28 by pressure-filling the through hole 26 with conductive paste from the opening to reach the end part of the inner electrode layer 24 on the through hole 26 side. COPYRIGHT: (C)2005,JPO&NCIPI