发明名称 PLATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To make a cleaning operation after plating for an article to be plated efficient, to facilitate a recovering operation for a plating liquid, and to enhance recovering efficiency of a plating liquid. SOLUTION: A plating apparatus has a sparger 20 for spraying the plating liquid onto the article 10 to be plated, installed in a plating tank 30 for setting the article 10, and supplies the plating liquid 42 to the sparger 20 from a plating liquid tank 40, to plate the article 10. The apparatus also has a plating nozzle 22 for spraying the plating liquid onto the article 10 to be plated, and a cleaning nozzle 24 for spraying a cleaning liquid 52 onto the article 10, installed in the sparger 20, so as to make the plating nozzle 22 communicate with the plating solution tank 40 and the cleaning nozzle 24 with a cleaning liquid tank 50, through each individual channel. The plating liquid tank 40 communicates with the plating tank 30, and receives the collected liquids of the plating liquid 42 used for plating the article 10, and the cleaning liquid 52 sprayed onto the plated article 10 from the cleaning nozzle 24. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004339534(A) 申请公布日期 2004.12.02
申请号 JP20030134054 申请日期 2003.05.13
申请人 SHINKO ELECTRIC IND CO LTD 发明人 YAMAMURO HIDEKAZU
分类号 C25D7/12;C25D17/00;C25D21/08;C25D21/18;H01L21/288;(IPC1-7):C25D17/00 主分类号 C25D7/12
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