| 摘要 |
An improved process for preparing assemblies comprising a metal plated plastic component having a transparent member, and the resulting assembly, are provided. The process includes molding a transparent plastic member of a non-plateable thermoplastic material; molding a plastic component around and/or on the transparent plastic member so that the transparent plastic member is physically trapped by the plastic component and/or chemically/electrostatically bonded to the plastic component, the plastic component being molded of a plateable thermoplastic material; and plating a metal onto the plastic component. The process involves fewer steps than known processes, results in less scrap and produces superior assemblies wherein the transparent member is more precisely in registry with the metal plated component.
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