| 发明名称 |
METHOD OF MANUFACTURING MULTILAYER CIRCUIT BOARD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer circuit board with high reliability in connection of circuit boards. <P>SOLUTION: A via hole 8 is formed in a tacky resin sheet 1 formed of thermosetting resin, and the via hole 8 is filled with conductive paste 9. The tacky resin sheet 1 and a component 11 are arranged between a plurality of the circuit boards 10 and a plurality of the circuit boards 10 are stacked. They are heated under pressurization, and the tacky resin sheet 1 is heat-cured. Consequently, a plurality of the circuit boards 10 are connected by a conductive paste 9, and the component 11 is embedded in the tacky sheet 1. Thermosetting resin at a periphery of the via hole 8 is previously cured before the via hole 8 is filled with the conductive paste 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2004342859(A) |
申请公布日期 |
2004.12.02 |
| 申请号 |
JP20030138034 |
申请日期 |
2003.05.16 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
HAYASHI YOSHITAKE;KOYAMA MASAYOSHI;YUHAKU SEI;OTANI KAZUO;KANZAWA HIDEO;TAKAHASHI SHOZO;TANIGUCHI HIROSHI |
| 分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
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