发明名称 Optical communication module
摘要 A substrate (2) is composed of laminated green sheets. The substrate (2) is provided with recesses (2f, 2g) formed on at least two locations deeper than implemented heights of ICs (4, 6) and elements (3, 5). A transmitter and a receiver are mounted in different recesses, which are individually covered with a mold resin to form a molded optical communication module (1), which operates fast and causes no optical and electrical crosstalk.
申请公布号 US2004240773(A1) 申请公布日期 2004.12.02
申请号 US20030658980 申请日期 2003.09.10
申请人 KOBINATA KATSUMI;FURUKAWA YOSHIKI;NOZAKI TAKAHIKO 发明人 KOBINATA KATSUMI;FURUKAWA YOSHIKI;NOZAKI TAKAHIKO
分类号 H05K3/28;G02B6/42;H01L31/02;H01L31/12;H01S5/026;H05K1/02;H05K1/03;H05K1/18;(IPC1-7):G02B6/12 主分类号 H05K3/28
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