| 摘要 |
A semiconductor device ( 100 ) comprising a semiconductor substrate ( 20 ) and a functional element ( 31 ), such as a microstrip, an inductor, a coupler or the like, is provided. Herein the functional element ( 31 ) is-at least partially-present in a conductive patterned layer that is mechanically embedded in isolating material ( 40 ) and that is connected to the substrate ( 20 ) through connection means. In this way, electrical losses through the substrate ( 20 ) are substantially reduced. The device ( 100 ) is provided in that a foil comprising the patterned layer and a carrier layer is applied to the substrate ( 20 ), after which the space between them is filled with the isolating material ( 40 ) and the carrier layer is removed. |
