| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device of a high density which has a strong structure against bending by extending the distance between a semiconductor chip and a substrate. <P>SOLUTION: A conductive connection member 10 for electrically connecting the semiconductor chip 1 to the substrate 3 is arranged between the semiconductor chip 1 and the substrate 3. The conductive connection member 10 consists of a resin core 11, a copper core 12 and a solder member 13, and the resin core 11 is arranged in the solder member 13 on the upper part of the copper core 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
