| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of mounting bare chip by which the void ratio can be reduced further. <P>SOLUTION: In the method of mounting bare chip, a gap is formed of projections 17 and a vacuum-sucked bare chip 11 between a substrate 10 and the bare chip 11 by placing a bare chip holding jip 12 on the surface of the substrate 10 on which the projections 17 are formed, in a state where the chip 11 is vacuum-sucked by means of the bare chip holding jig 12 having an opening 15 in one side wall. Then solder 16 is supplied to one side of the gap and melted. Thereafter, the molten solder 16a is caused to enter into the gap between the substrate 10 and the bare chip 11 by utilizing a capillary phenomenon and the wetting action of the solder 16a. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
